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	Design consideration of the thermal and electro stability of multi-finger HBTs based on different device structures
	Yanhu, Chen; Huajun, Shen; Xinyu, Liu; Hui, Xu; Ling, Li; Huijun, Li
刊名	Journal of Semiconductors
	2010
卷号	31期号:10
关键词	Electro stability Heterojunction bipolar transistor Thermal stability
DOI	10.1088/1674-4926/31/10/104003
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5499244
专题	山东大学
作者单位	1.School of Information Science and Engineering, Shandong University, Jinan 250100, China 2.[Huajun, Shen 3.X
推荐引用方式 GB/T 7714	Yanhu, Chen,Huajun, Shen,Xinyu, Liu,et al. Design consideration of the thermal and electro stability of multi-finger HBTs based on different device structures[J]. Journal of Semiconductors,2010,31(10).
APA	Yanhu, Chen,Huajun, Shen,Xinyu, Liu,Hui, Xu,Ling, Li,&Huijun, Li.(2010).Design consideration of the thermal and electro stability of multi-finger HBTs based on different device structures.Journal of Semiconductors,31(10).
MLA	Yanhu, Chen,et al."Design consideration of the thermal and electro stability of multi-finger HBTs based on different device structures".Journal of Semiconductors 31.10(2010).

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