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	Preparation and enhanced thermoelectric performance of CuSe-SnSe composite materials
	Zhi Peng; Danqi He; Xin Mu; Hongyu Zhou; Cuncheng Li; Shifang Ma; Pengxia Ji; Weikang Hou; Ping Wei; Wanting Zhu
刊名	Journal of Electronic Materials
	2018
卷号	Vol.47 No.6页码:3350-3357
ISSN号	0361-5235
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5460286
专题	湖南大学
推荐引用方式 GB/T 7714	Zhi Peng,Danqi He,Xin Mu,et al. Preparation and enhanced thermoelectric performance of CuSe-SnSe composite materials[J]. Journal of Electronic Materials,2018,Vol.47 No.6:3350-3357.
APA	Zhi Peng.,Danqi He.,Xin Mu.,Hongyu Zhou.,Cuncheng Li.,...&Wenyu Zhao.(2018).Preparation and enhanced thermoelectric performance of CuSe-SnSe composite materials.Journal of Electronic Materials,Vol.47 No.6,3350-3357.
MLA	Zhi Peng,et al."Preparation and enhanced thermoelectric performance of CuSe-SnSe composite materials".Journal of Electronic Materials Vol.47 No.6(2018):3350-3357.

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