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	High-accuracy three-dimensional shape measurement of micro solder paste and printed circuits based on digital image correlation
	Xian Zhang; Yong Su; Zeren Gao; Tan Xu; Xiaohua Ding; Qifeng Yu; Qingchuan Zhang
刊名	Optical Engineering
	2018
卷号	Vol.57 No.5页码:054101
ISSN号	0091-3286
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5460083
专题	湖南大学
推荐引用方式 GB/T 7714	Xian Zhang,Yong Su,Zeren Gao,et al. High-accuracy three-dimensional shape measurement of micro solder paste and printed circuits based on digital image correlation[J]. Optical Engineering,2018,Vol.57 No.5:054101.
APA	Xian Zhang.,Yong Su.,Zeren Gao.,Tan Xu.,Xiaohua Ding.,...&Qingchuan Zhang.(2018).High-accuracy three-dimensional shape measurement of micro solder paste and printed circuits based on digital image correlation.Optical Engineering,Vol.57 No.5,054101.
MLA	Xian Zhang,et al."High-accuracy three-dimensional shape measurement of micro solder paste and printed circuits based on digital image correlation".Optical Engineering Vol.57 No.5(2018):054101.

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