Thermal fatigue analysis of HSK shrink toolholder | |
Chen, Jian[1]; Tian, Liang[2]; Shang, Hong Mo[3]; Wang, Gui Cheng[4] | |
2014 | |
会议名称 | 2013 3rd International Conference on Mechatronics and Applied Mechanics, ICMAM 2013 |
会议日期 | 2013-12-27 |
页码 | 408-412 |
收录类别 | EI |
URL标识 | 查看原文 |
内容类型 | 会议论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/5397421 |
专题 | 江苏大学 |
作者单位 | [1]Institute of Precision Engineering, Jiang Su University, Zhenjiang, China |Chengdu tool research institute co., LTD, Chengdu, China[2]Chengdu tool research institute co., LTD, Chengdu, China[3]Chengdu tool research institute co., LTD, Chengdu, China[4]Institute of Precision Engineering, Jiang Su University, Zhenjiang, China |
推荐引用方式 GB/T 7714 | Chen, Jian[1],Tian, Liang[2],Shang, Hong Mo[3],et al. Thermal fatigue analysis of HSK shrink toolholder[C]. 见:2013 3rd International Conference on Mechatronics and Applied Mechanics, ICMAM 2013. 2013-12-27. |
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