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	Interfacial heat transfer properties of the typical interconnection structures in IC packaging: A multiscale study
	Zhang, Liqiang[1]; Tang, Yunqing[2]; Gong, Jie[3]; Liu, Dongjing[4]; Yu, Lijia[5]; Deng, Lin[6]; Li, Zhibao[7]; Zhi, Liangze[8]
	2014
页码	110-120
收录类别	EI
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/5396682
专题	江苏大学
作者单位	[1]Laboratory of Span-Scale Design and Manufacturing for MEMS/NEMS/OEDS, School of Mechanical Engineering, Jiangsu University, Zhenjiang, China [2]Laboratory of Span-Scale Design and Manufacturing for MEMS/NEMS/OEDS, School of Mechanical Engineering, Jiangsu University, Zhenjiang, China [3]Laboratory of Span-Scale Design and Manufacturing for MEMS/NEMS/OEDS, School of Mechanical Engineering, Jiangsu University, Zhenjiang, China [4]Laboratory of Span-Scale Design and Manufacturing for MEMS/NEMS/OEDS, School of Mechanical Engineering, Jiangsu University, Zhenjiang, China [5]Laboratory of Span-Scale Design and Manufacturing for MEMS/NEMS/OEDS, School of Mechanical Engineering, Jiangsu University, Zhenjiang, China [6]Laboratory of Span-Scale Design and Manufacturing for MEMS/NEMS/OEDS, School of Mechanical Engineering, Jiangsu University, Zhenjiang, China [7]School of Mechanical Engineering, Jiangsu University, Zhenjiang, China[8]School of Mechanical Engineering, Jiangsu University, Zhenjiang, China
推荐引用方式 GB/T 7714	Zhang, Liqiang[1],Tang, Yunqing[2],Gong, Jie[3],et al. Interfacial heat transfer properties of the typical interconnection structures in IC packaging: A multiscale study[C]. 见:.

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