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	The annealing effects on the formability of T2 copper foil in micro deep drawing process by laser driven flyer
	Hu, Yang[1]; Liu, Huixia[2]; Gu, Chunxing[3]; Shen, Zongbao[4]; Wang, Xiao[5]
刊名	Key Engineering Materials
	2014
卷号	579-580页码:35-40
ISSN号	10139826
DOI	http://dx.doi.org/10.4028/www.scientific.net/KEM.579-580.35
URL标识	查看原文
收录类别	EI
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5396220
专题	江苏大学
作者单位	[1]School of Mechanical Engineering, Jiangsu University, Zhenjiang 212013, China[2]School of Mechanical Engineering, Jiangsu University, Zhenjiang 212013, China[3]School of Mechanical Engineering, Jiangsu University, Zhenjiang 212013, China[4]School of Mechanical Engineering, Jiangsu University, Zhenjiang 212013, China[5]School of Mechanical Engineering, Jiangsu University, Zhenjiang 212013, China
推荐引用方式 GB/T 7714	Hu, Yang[1],Liu, Huixia[2],Gu, Chunxing[3],et al. The annealing effects on the formability of T2 copper foil in micro deep drawing process by laser driven flyer[J]. Key Engineering Materials,2014,579-580:35-40.
APA	Hu, Yang[1],Liu, Huixia[2],Gu, Chunxing[3],Shen, Zongbao[4],&Wang, Xiao[5].(2014).The annealing effects on the formability of T2 copper foil in micro deep drawing process by laser driven flyer.Key Engineering Materials,579-580,35-40.
MLA	Hu, Yang[1],et al."The annealing effects on the formability of T2 copper foil in micro deep drawing process by laser driven flyer".Key Engineering Materials 579-580(2014):35-40.

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