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	Nanometer-thick copper films grown by thermal atomic layer deposition
	Zhong, Zhenyu[1]; Wang, Xiuqin[2]; Ding, Jianning[3]; Yuan, Ningyi[4]
刊名	THIN SOLID FILMS
	2015
卷号	589页码:673-680
关键词	Nanometer-thick copper film Thermal atomic layer deposition Electrical property
ISSN号	0040-6090
DOI	http://dx.doi.org/10.1016/j.tsf.2015.06.053
URL标识	查看原文
收录类别	SCI(E) ; EI
WOS记录号	WOS:000360320000106
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5394264
专题	江苏大学
作者单位	1.[1]Changzhou Univ, Jiangsu Collaborat Innovat Ctr Photovolta Sci & E, Sch Mat Sci & Engn, Changzhou 213164, Jiangsu, Peoples R China.,Changzhou Univ, Jiangsu Key Lab Photovolta Engn & Sci, Changzhou 213164, Jiangsu, Peoples R China. 2.[2]Changzhou Univ, Jiangsu Collaborat Innovat Ctr Photovolta Sci & E, Sch Mat Sci & Engn, Changzhou 213164, Jiangsu, Peoples R China.,Changzhou Univ, Jiangsu Key Lab Photovolta Engn & Sci, Changzhou 213164, Jiangsu, Peoples R China. 3.Jiangsu Univ, Micro Nano Sci & Technol Ctr, Zhenjiang 212013, Peoples R China. 4.[3]Changzhou Univ, Jiangsu Collaborat Innovat Ctr Photovolta Sci & E, Sch Mat Sci & Engn, Changzhou 213164, Jiangsu, Peoples R China.,Changzhou Univ, Jiangsu Key Lab Photovolta Engn & Sci, Changzhou 213164, Jiangsu, Peoples R China. 5.Jiangsu Univ, Micro Nano Sci & Technol Ctr, Zhenjiang 212013, Peoples R China. 6.[4]Changzhou Univ, Jiangsu Collaborat Innovat Ctr Photovolta Sci & E, Sch Mat Sci & Engn, Changzhou 213164, Jiangsu, Peoples R China.,Changzhou Univ, Jiangsu Key Lab Photovolta Engn & Sci, Changzhou 213164, Jiangsu, Peoples R China.
推荐引用方式 GB/T 7714	Zhong, Zhenyu[1],Wang, Xiuqin[2],Ding, Jianning[3],et al. Nanometer-thick copper films grown by thermal atomic layer deposition[J]. THIN SOLID FILMS,2015,589:673-680.
APA	Zhong, Zhenyu[1],Wang, Xiuqin[2],Ding, Jianning[3],&Yuan, Ningyi[4].(2015).Nanometer-thick copper films grown by thermal atomic layer deposition.THIN SOLID FILMS,589,673-680.
MLA	Zhong, Zhenyu[1],et al."Nanometer-thick copper films grown by thermal atomic layer deposition".THIN SOLID FILMS 589(2015):673-680.

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