Thermal Model Design and Analysis of High-Power LED Headlamp Cooling Device Based on the Thermoelectric Effect | |
Wang, Jing[1]; Zhao, Xin-Jie[2]; Cai, Yi-Xi[3]; Zhang, Chun[4]; Bao, Wei-Wei[5] | |
刊名 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY |
2015 | |
卷号 | 5期号:5页码:641-649 |
关键词 | Junction temperature light-emitting diode (LED) headlight output light thermal performance thermoelectric cooler (TEC) |
ISSN号 | 2156-3950 |
DOI | http://dx.doi.org/10.1109/TCPMT.2015.2413777 |
URL标识 | 查看原文 |
收录类别 | SCI(E) ; EI |
WOS记录号 | WOS:000355936500009 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/5393899 |
专题 | 江苏大学 |
作者单位 | 1.[1]Jiangsu Univ, Sch Automot & Traff Engn, Zhenjiang 210213, Peoples R China. 2.Jiangsu Univ, Vehicle Prod Lab, Zhenjiang 210213, Peoples R China. 3.[2]Jiangsu Univ, Sch Automot & Traff Engn, Zhenjiang 210213, Peoples R China. 4.[3]Jiangsu Univ, Sch Automot & Traff Engn, Zhenjiang 210213, Peoples R China. 5.[4]Jiangsu Univ, Sch Automot & Traff Engn, Zhenjiang 210213, Peoples R China. 6.[5]Jiangsu Univ, Sch Automot & Traff Engn, Zhenjiang 210213, Peoples R China. |
推荐引用方式 GB/T 7714 | Wang, Jing[1],Zhao, Xin-Jie[2],Cai, Yi-Xi[3],et al. Thermal Model Design and Analysis of High-Power LED Headlamp Cooling Device Based on the Thermoelectric Effect[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2015,5(5):641-649. |
APA | Wang, Jing[1],Zhao, Xin-Jie[2],Cai, Yi-Xi[3],Zhang, Chun[4],&Bao, Wei-Wei[5].(2015).Thermal Model Design and Analysis of High-Power LED Headlamp Cooling Device Based on the Thermoelectric Effect.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,5(5),641-649. |
MLA | Wang, Jing[1],et al."Thermal Model Design and Analysis of High-Power LED Headlamp Cooling Device Based on the Thermoelectric Effect".IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 5.5(2015):641-649. |
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