| Material Removal Mechanism of Chemo-mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW) | |
| Guo, D. M.; Tian, Y. B.; Kang, R. K.; Zhou, L.; Lei, M. K. | |
| 2009 | |
| 会议名称 | 11th International Symposium on Advances in Abrasive Technology |
| 会议日期 | 2009-01-01 |
| 会议地点 | Awaji City, JAPAN |
| 关键词 | Silicon wafers mechanism ultra-precision grinding CMG XPS SAGW |
| 页码 | 459-+ |
| 会议录 | 11th International Symposium on Advances in Abrasive Technology
 |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5323803 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.Dalian Univ Technol, Key Lab Precis & Nontradit Machining, Minist Educ, Dalian 116024, Peoples R China. 2.Dalian Univ Technol, Sch Mat Sci & Engn, Surface Engn Lab, Dalian 116024, Peoples R China. 3.Ibaraki Univ, Venture Business Lab VBL, Nakanarusawa, Hitachi 3168511, Japan. 4.Ibaraki Univ, Dept Inteiligent Syst Engn, Nakanarusawa, Hitachi 3168511, Japan. 5.Dalian Univ Technol, Sch Mat Sci & Engn, Surface Engn Lab, Dalian 116024, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Guo, D. M.,Tian, Y. B.,Kang, R. K.,et al. Material Removal Mechanism of Chemo-mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW)[C]. 见:11th International Symposium on Advances in Abrasive Technology. Awaji City, JAPAN. 2009-01-01. |
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