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	Integrated VCSELs on traditional VLSI packaging
	MORRIS, TERREL L.
	2005-12-13
著作权人	HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
专利号	US6975514
国家	美国
文献子类	授权发明
其他题名	Integrated VCSELs on traditional VLSI packaging
英文摘要	A circuit module including at least one Application Specific Integrated Circuit (ASIC) and a plurality of Vertical Cavity Surface-Emitting Laser (VCSEL) array modules is built using a standard ceramic or organic VLSI package substrate, resulting is a high density device with a small footprint. Interconnection between the electronic devices and the VCSEL array modules is accomplished using standard integrated circuit packaging technology and flexible connectors. Optical connections from the VCSEL arrays to fiber optic cables are made possible by integrating industry-standard optical connectors onto the package. Optical receiver and transceiver modules may also be incorporated into the circuit module.
公开日期	2005-12-13
申请日期	2003-01-31
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/43076]
专题	半导体激光器专利数据库
作者单位	HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
推荐引用方式 GB/T 7714	MORRIS, TERREL L.. Integrated VCSELs on traditional VLSI packaging. US6975514. 2005-12-13.

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