Semiconductor laser device, a semiconductor wafer
KONDO, MASAKI; SASAKI, KAZUAKI; MORIMOTO, TAIJI; MATSUMOTO, MITSUHIRO; HOSOBA, HIROYUKI; MATSUI, SADAYOSHI; YAMAMOTO, SABURO; SUYAMA, TAKAHIRO; KONDO, MASAFUMI
1991-08-20
著作权人SHARP KABUSHIKI KAISHA
专利号US5042044
国家美国
文献子类授权发明
其他题名Semiconductor laser device, a semiconductor wafer
英文摘要A semiconductor laser device and a method for the production of the semiconductor laser device are provided, which semiconductor laser device includes a striped channel formed in a semiconductor substrate through a current blocking layer on the substrate and at least two dummy grooves formed in the current blocking layer on each side of the striped channel. Also provided are a semiconductor wafer prepared for the purpose of producing optical devices with an optical waveguide, and a method for the production of the semiconductor wafer. The semiconductor wafer includes a semiconductor substrate, the surface of which has an orientation inclined from the [100] direction to one of the [011] and [011] directions of an angle .theta. satisfying the relationship 0.degree.<.vertline..theta..vertline.<4.degree.; a plurality of striped channels formed in a substrate through a current blocking layer in the direction of the other of the [011] and [011] directions; and at least one dummy side groove formed between the striped channels, having a combined cross-sectional area on the plane perpendicular to the other direction greater than that of each of the striped channels.
公开日期1991-08-20
申请日期1990-04-27
状态失效
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/42078]  
专题半导体激光器专利数据库
作者单位SHARP KABUSHIKI KAISHA
推荐引用方式
GB/T 7714
KONDO, MASAKI,SASAKI, KAZUAKI,MORIMOTO, TAIJI,et al. Semiconductor laser device, a semiconductor wafer. US5042044. 1991-08-20.
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