Method and system for epitaxy processes on miscut bulk substrates
CHAKRABORTY, ARPAN; GRUNDMANN, MICHAEL; TYAGI, ANURAG
2017-05-16
著作权人SORAA, INC.
专利号US9653650
国家美国
文献子类授权发明
其他题名Method and system for epitaxy processes on miscut bulk substrates
英文摘要A method for providing (Al,Ga,In)N thin films on Ga-face c-plane (Al,Ga,In)N substrates using c-plane surfaces with a miscut greater than at least 0.35 degrees toward the m-direction. Light emitting devices are formed on the smooth (Al,Ga,In)N thin films. Devices fabricated on the smooth surfaces exhibit improved performance.
公开日期2017-05-16
申请日期2016-01-11
状态授权
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/38677]  
专题半导体激光器专利数据库
作者单位SORAA, INC.
推荐引用方式
GB/T 7714
CHAKRABORTY, ARPAN,GRUNDMANN, MICHAEL,TYAGI, ANURAG. Method and system for epitaxy processes on miscut bulk substrates. US9653650. 2017-05-16.
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