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	Method of manufacturing LED component by integrating epitaxial structure and package substrate together
	CHEN, JEN-SHYAN
	2015-02-17
著作权人	HONG KONG BEIDA JADE BIRD DISPLAY LIMITED
专利号	US8956901
国家	美国
文献子类	授权发明
其他题名	Method of manufacturing LED component by integrating epitaxial structure and package substrate together
英文摘要	An integral LED component is mounted into a hollow carrier. The carrier has two conductive electrodes with opposite polarities. The LED component comprises a substrate, N number of LED epitaxial structures where N is a number greater than one, a third electrode and a fourth electrode. The N number of LED epitaxial structures are formed on the upper surface of the substrate, the at least one of the N number of LED epitaxial structures comprises a first and a second electrode. The third and fourth electrodes are formed on the upper surface and located outside the N number of LED epitaxial structures, the respective electrodes are electrically connected to form a circuit. The two conductive electrodes of the hollow carrier are used for electrically connecting the third and fourth electrodes of the substrate, and the lower surface of the substrate is exposed to the hollow carrier.
公开日期	2015-02-17
申请日期	2014-04-29
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/38650]
专题	半导体激光器专利数据库
作者单位	HONG KONG BEIDA JADE BIRD DISPLAY LIMITED
推荐引用方式 GB/T 7714	CHEN, JEN-SHYAN. Method of manufacturing LED component by integrating epitaxial structure and package substrate together. US8956901. 2015-02-17.

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