Etched trenches in bond materials for die singulation, and associated systems and methods | |
ODNOBLYUDOV, VLADIMIR; SCHELLHAMMER, SCOTT D.; FREI, JEREMY S. | |
2015-02-10 | |
著作权人 | MICRON TECHNOLOGY, INC. |
专利号 | US8952413 |
国家 | 美国 |
文献子类 | 授权发明 |
其他题名 | Etched trenches in bond materials for die singulation, and associated systems and methods |
英文摘要 | Etched trenches in a bond material for die singulation, and associated systems and methods are disclosed. A method for solid state transducer device singulation in accordance with one embodiment includes forming a plurality of trenches by etching through a metallic bond material forming a bond between a carrier substrate and a plurality of the dies and singulating the carrier substrate along the trenches to separate the dies. In particular embodiments, the trenches extend into the carrier substrate. In further particular embodiments, the dies are at least partially encapsulated in a dielectric material. |
公开日期 | 2015-02-10 |
申请日期 | 2012-03-08 |
状态 | 授权 |
内容类型 | 专利 |
源URL | [http://ir.opt.ac.cn/handle/181661/38594] |
专题 | 半导体激光器专利数据库 |
作者单位 | MICRON TECHNOLOGY, INC. |
推荐引用方式 GB/T 7714 | ODNOBLYUDOV, VLADIMIR,SCHELLHAMMER, SCOTT D.,FREI, JEREMY S.. Etched trenches in bond materials for die singulation, and associated systems and methods. US8952413. 2015-02-10. |
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