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	Strain-tolerant die attach with improved thermal conductivity, and method of fabrication
	KARLICEK, JR., ROBERT F.
	2019-09-10
著作权人	SOLIDUV, INC.
专利号	US10410958
国家	美国
文献子类	授权发明
其他题名	Strain-tolerant die attach with improved thermal conductivity, and method of fabrication
英文摘要	A mechanically-stable and thermally-conductive interface device between a semiconductor die and a package for the die, and related method of fabrication, comprising: a semiconductor die; a package for the die; a surface area-enhancing pattern on the package and/or the die; and die attach materials between the die and the package, the die attach materials attaching the die to the package through an interface provided by the die attach materials; wherein: an effective bonding area between the die attach materials and the package and/or the die is greater with the pattern than without the pattern; and the increase of the effective bonding area simultaneously increases the surface area for thermal transport between the package and/or the die, and the die attach materials; and increases the surface area for stably attaching the at least one of the package and the die to the die attach materials.
公开日期	2019-09-10
申请日期	2017-07-26
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/38014]
专题	半导体激光器专利数据库
作者单位	SOLIDUV, INC.
推荐引用方式 GB/T 7714	KARLICEK, JR., ROBERT F.. Strain-tolerant die attach with improved thermal conductivity, and method of fabrication. US10410958. 2019-09-10.

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