Inverse diode stack
ETTINGSHAUSEN, FRANK; SPANN, THOMAS; WISOTZKI, ELMAR
2018-04-10
著作权人LITTELFUSE, INC.
专利号US9941256
国家美国
文献子类授权发明
其他题名Inverse diode stack
英文摘要A packaged inverse diode device exhibits superior commutation robustness. The device includes a stack of inverse diodes disposed within a housing. Each adjacent pair of inverse diodes is bonded together by an intervening DMB (Direct Metal Bonded) substrate structure. At one end of the stack of diode dice and DMB substrate structures is attached a first metal terminal. A second metal terminal is attached to the other end of the stack. The two terminals serve as package terminals of the overall device. In a novel method, the device undergoes severe commutation. A large forward current is made to flow through the diode stack, followed by a rapid reversal of the voltage across the stack to a large reverse polarity voltage. Despite a substantial rate of change of the commutation current at the onset of the reverse voltage condition, the inverse diode device is not damaged.
公开日期2018-04-10
申请日期2016-12-21
状态授权
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/37949]  
专题半导体激光器专利数据库
作者单位LITTELFUSE, INC.
推荐引用方式
GB/T 7714
ETTINGSHAUSEN, FRANK,SPANN, THOMAS,WISOTZKI, ELMAR. Inverse diode stack. US9941256. 2018-04-10.
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