QQ客服 官方微博 反馈留言

	Semiconductor laser module and three-dimensional laminating and shaping apparatus
	ISHIGE, YUTA; KATAYAMA, ETSUJI; MORI, HAJIME
	2019-03-19
著作权人	TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING
专利号	US10234645
国家	美国
文献子类	授权发明
其他题名	Semiconductor laser module and three-dimensional laminating and shaping apparatus
英文摘要	A variation in coupling ratio of output light from a laser element to an optical fiber is suppressed. A semiconductor laser module including a plurality of semiconductor laser elements, an optical fiber, a condenser that condenses a laser beam emitted from each of the semiconductor laser elements to the optical fiber, and a housing that implements the laser elements, the condenser, and the optical fiber includes at least one thin plate that is arranged between the laser elements and a top of the housing, and arranged on the top to form a gap with the top.
公开日期	2019-03-19
申请日期	2016-09-14
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37912]
专题	半导体激光器专利数据库
作者单位	TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING
推荐引用方式 GB/T 7714	ISHIGE, YUTA,KATAYAMA, ETSUJI,MORI, HAJIME. Semiconductor laser module and three-dimensional laminating and shaping apparatus. US10234645. 2019-03-19.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。