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	Flexible electronic circuits with embedded integrated circuit die
	DALAL, MITUL; GUPTA, SANJAY
	2018-02-20
著作权人	MC10, INC.
专利号	US9899330
国家	美国
文献子类	授权发明
其他题名	Flexible electronic circuits with embedded integrated circuit die
英文摘要	Flexible integrated circuit (IC) modules, flexible IC devices, and methods of making and using flexible IC modules are presented herein. A flexible integrated circuit module is disclosed which includes a flexible substrate and a semiconductor die attached to the flexible substrate. An encapsulating layer, which is attached to the flexible substrate, includes a thermoplastic resin and/or a polyimide adhesive encasing therein the semiconductor die. The encapsulating layer may be an acrylic-based thermally conductive and electrically isolating polyimide adhesive. Optionally, the encapsulating layer may be a B-stage FR-4 glass-reinforced epoxy thermoplastic polymer or copolymer or blend. The die may be embedded between two flexible substrates, each of which includes a layer of flexible polymer, such as a polyimide sheet, with two layers of conductive material, such as copper cladding, disposed on opposing sides of the layer of flexible polymer.
公开日期	2018-02-20
申请日期	2015-09-30
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37843]
专题	半导体激光器专利数据库
作者单位	MC10, INC.
推荐引用方式 GB/T 7714	DALAL, MITUL,GUPTA, SANJAY. Flexible electronic circuits with embedded integrated circuit die. US9899330. 2018-02-20.

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