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	Heat transfer device for high heat flux applications and related methods thereof
	HAJ-HARIRI, HOSSEIN; MIRALIPOUR, SEYED REZA MONAZAMI
	2019-02-26
著作权人	UNIVERSITY OF VIRGINIA PATENT FOUNDATION
专利号	US10217692
国家	美国
文献子类	授权发明
其他题名	Heat transfer device for high heat flux applications and related methods thereof
英文摘要	A device and related method that provides a two-phase heat transfer device with a combination of enhanced evaporation and increase cooling capacity. A recess topology is used to increase suction of working fluid toward a heat source. A non-wetting coating or structure may be used to keep working fluid away from the spaces between elongated members of an evaporator and a wetting coating or structure may be used to form thin films of working fluid around the distal regions of elongated members. The devices and method described herein may be used to cool computer chips, the skin of a hypersonic flying object, a parabolic solar collector, a turbine engine blade, or other heat sources that require high heat flux.
公开日期	2019-02-26
申请日期	2015-07-22
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37827]
专题	半导体激光器专利数据库
作者单位	UNIVERSITY OF VIRGINIA PATENT FOUNDATION
推荐引用方式 GB/T 7714	HAJ-HARIRI, HOSSEIN,MIRALIPOUR, SEYED REZA MONAZAMI. Heat transfer device for high heat flux applications and related methods thereof. US10217692. 2019-02-26.

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