| Package for ultraviolet emitting devices | |
| WEST, ROBERT S.; LIAO, YITAO; COLLINS, DOUGLAS A. | |
| 2018-04-17 | |
| 著作权人 | RAYVIO CORPORATION |
| 专利号 | US9947844 |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Package for ultraviolet emitting devices |
| 英文摘要 | Embodiments of the invention include a light emitting diode including a semiconductor structure including an active layer disposed between an n-type region and a p-type region. The active layer emits UV radiation. A first metal layer is in direct contact with the p-type region. A second metal layer is in direct contact with the n-type region. The first and second metal layers are both formed on a first side of the semiconductor structure. A transparent optic is optically coupled to a major surface of the light emitting diode. |
| 公开日期 | 2018-04-17 |
| 申请日期 | 2015-04-10 |
| 状态 | 授权 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37815]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | RAYVIO CORPORATION |
| 推荐引用方式 GB/T 7714 | WEST, ROBERT S.,LIAO, YITAO,COLLINS, DOUGLAS A.. Package for ultraviolet emitting devices. US9947844. 2018-04-17. |
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