Package for ultraviolet emitting devices | |
WEST, ROBERT S.; LIAO, YITAO; COLLINS, DOUGLAS A. | |
2018-04-17 | |
著作权人 | RAYVIO CORPORATION |
专利号 | US9947844 |
国家 | 美国 |
文献子类 | 授权发明 |
其他题名 | Package for ultraviolet emitting devices |
英文摘要 | Embodiments of the invention include a light emitting diode including a semiconductor structure including an active layer disposed between an n-type region and a p-type region. The active layer emits UV radiation. A first metal layer is in direct contact with the p-type region. A second metal layer is in direct contact with the n-type region. The first and second metal layers are both formed on a first side of the semiconductor structure. A transparent optic is optically coupled to a major surface of the light emitting diode. |
公开日期 | 2018-04-17 |
申请日期 | 2015-04-10 |
状态 | 授权 |
内容类型 | 专利 |
源URL | [http://ir.opt.ac.cn/handle/181661/37815] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | RAYVIO CORPORATION |
推荐引用方式 GB/T 7714 | WEST, ROBERT S.,LIAO, YITAO,COLLINS, DOUGLAS A.. Package for ultraviolet emitting devices. US9947844. 2018-04-17. |
个性服务 |
查看访问统计 |
相关权益政策 |
暂无数据 |
收藏/分享 |
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。
修改评论