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	Thermally conductive silicone composition and electrical/electronic apparatus
	KATO, TOMOKO; KODAMA, HARUMI; ONISHI, MASAYUKI
	2018-12-11
著作权人	DOW CORNING TORAY CO., LTD.
专利号	US10150902
国家	美国
文献子类	授权发明
其他题名	Thermally conductive silicone composition and electrical/electronic apparatus
英文摘要	Provided are a thermally conductive silicone composition excelling in heat resistance and thermal conductivity, in which thickening in an uncured state is suppressed, and which has excellent handling ease; and an electrical/electronic apparatus in which the thermally conductive silicone composition is used as a member. The thermally conductive silicone composition comprises (A) 100 parts by mass of either i) (a1) an organopolysiloxane having, in each molecule thereof, at least one alkoxysilyl-containing group bonded to a silicon atom and expressed by the general formula: and as generally described herein, or ii) a mixture of component (a1) and (a2) an organopolysiloxane having in each molecule thereof, at least two alkenyl groups but not the alkoxysilyl-containing group. In the mixture, the content of component (a1) is 10 to less than 100 mass %. The thermally conductive silicone composition further comprises (B) 400 to 3,500 parts by mass of a thermally conductive filler.
公开日期	2018-12-11
申请日期	2015-03-26
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37813]
专题	半导体激光器专利数据库
作者单位	DOW CORNING TORAY CO., LTD.
推荐引用方式 GB/T 7714	KATO, TOMOKO,KODAMA, HARUMI,ONISHI, MASAYUKI. Thermally conductive silicone composition and electrical/electronic apparatus. US10150902. 2018-12-11.

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