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	High-power electronic devices containing metal nanoparticle-based thermal interface materials and related methods
	PAOLELLA, ARTHUR; WINTER, ADAM THERON; DEGLER, DAVID S.; ZINN, ALFRED A.; ERMER, SUSAN PATRICIA
	2015-11-17
著作权人	KUPRION INC.
专利号	US9190342
国家	美国
文献子类	授权发明
其他题名	High-power electronic devices containing metal nanoparticle-based thermal interface materials and related methods
英文摘要	High-power electronic components generate significant amounts of heat that must be removed in the course of normal device operations. Certain types of electronic components, such as some monolithic microwave integrated circuits and LEDs, can contain materials that are difficult to effectively bond to a heat gink in order to establish a thermal interface between the two. Device assemblies can include a heat-generating electronic component in thermal communication with a metallic heat sink via a metallic thermal interface layer. The metallic thermal interface layer is disposed between the heat-generating electronic component and the metallic heat sink. The metallic thermal interface layer is formed from a composition including a plurality of metal nanoparticles that are at least partially fused together with one another. Methods for forming a thermal interface layer include heating metal nanoparticles above their fusion temperature and subsequently cooling the liquefied metal nanoparticles to promote bonding of the electronic component.
公开日期	2015-11-17
申请日期	2014-08-22
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37770]
专题	半导体激光器专利数据库
作者单位	KUPRION INC.
推荐引用方式 GB/T 7714	PAOLELLA, ARTHUR,WINTER, ADAM THERON,DEGLER, DAVID S.,et al. High-power electronic devices containing metal nanoparticle-based thermal interface materials and related methods. US9190342. 2015-11-17.

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