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	Method for incorporating stress sensitive chip scale components into reconstructed wafer based modules
	KARPMAN, MAURICE
	2017-08-15
著作权人	THE CHARLES STARK DRAPER LABORATORY, INC.
专利号	US9735128
国家	美国
文献子类	授权发明
其他题名	Method for incorporating stress sensitive chip scale components into reconstructed wafer based modules
英文摘要	Techniques for constructing an electronic module are provided herein. For example, the techniques include orienting at least one die having a top side (e.g., a first side), a bottom side (e.g., a second side) and one or more side walls, on a substrate with the top side of the die proximate the substrate, coating the bottom side and each of the side walls of the die with a stress buffer material, forming a reconstructed wafer by encapsulating the coated die within a mold compound, and removing the substrate to expose the top side of the die.
公开日期	2017-08-15
申请日期	2014-02-11
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37731]
专题	半导体激光器专利数据库
作者单位	THE CHARLES STARK DRAPER LABORATORY, INC.
推荐引用方式 GB/T 7714	KARPMAN, MAURICE. Method for incorporating stress sensitive chip scale components into reconstructed wafer based modules. US9735128. 2017-08-15.

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