| Semiconductor device structure | |
| KIM, CHANG TAE; KO, JAE SUNG; KIM, SEOK JUNG; LEE, CHANG HUN | |
| 2017-09-26 | |
| 著作权人 | CTLAB CO., LTD. |
| 专利号 | US9773950 |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Semiconductor device structure |
| 英文摘要 | The present disclosure relates to a method for manufacturing a semiconductor device structure, comprising the steps of: securing the position of a semiconductor device on a plate; securing the positions of electrodes such that the electrodes face the plate; covering the semiconductor device with an encapsulating material; and separating, from the plate, the semiconductor device covered with the encapsulating material. |
| 公开日期 | 2017-09-26 |
| 申请日期 | 2013-04-05 |
| 状态 | 授权 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37664]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | CTLAB CO., LTD. |
| 推荐引用方式 GB/T 7714 | KIM, CHANG TAE,KO, JAE SUNG,KIM, SEOK JUNG,et al. Semiconductor device structure. US9773950. 2017-09-26. |
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