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	Semiconductor device and heat sink with 3-dimensional thermal conductivity
	KURODA, NAOTAKA; WAKEJIMA, AKIO; TANOMURA, MASAHIRO; MIYAMOTO, HIRONOBU
	2013-07-02
著作权人	NEC CORPORATION
专利号	US8476756
国家	美国
文献子类	授权发明
其他题名	Semiconductor device and heat sink with 3-dimensional thermal conductivity
英文摘要	A semiconductor device includes a semiconductor element having a rectangular two-dimensional geometry and serving as a heat source, a first heat sink section including the semiconductor element mounted thereon, and a second heat sink section joined to an opposite side of the first heat sink section that includes the semiconductor element. A relation among directional components of thermal conductivity is K1yy≧K1xx>K1zz, where directional components of a three-dimensional thermal conductivity of the heat sink section in X, Y, and Z directions are determined as Kxx, Kyy, and Kzz. A relation among directional components of a thermal conductivity of the second heat sink section is K2zz≧K2yy>K2xx or K2yy≧K2zz>K2xx, where the directional components of the thermal conductivity of the second heat sink section in X, Y, and X directions are determined as K2xx, K2yy, and K2zz.
公开日期	2013-07-02
申请日期	2011-09-21
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37547]
专题	半导体激光器专利数据库
作者单位	NEC CORPORATION
推荐引用方式 GB/T 7714	KURODA, NAOTAKA,WAKEJIMA, AKIO,TANOMURA, MASAHIRO,et al. Semiconductor device and heat sink with 3-dimensional thermal conductivity. US8476756. 2013-07-02.

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