System for using active and passive cooling for high power thermal management | |
BHUNIA, AVIJIT; CAI, QINGJUN; CHEN, CHUNG-LUNG | |
2018-06-26 | |
著作权人 | TELEDYNE SCIENTIFIC & IMAGING, LLC |
专利号 | US10006720 |
国家 | 美国 |
文献子类 | 授权发明 |
其他题名 | System for using active and passive cooling for high power thermal management |
英文摘要 | A cooling system that includes a substrate having a metallic face, at least one microporous wick formation in thermal communication with the metallic face, and a liquid delivery head positioned in complementary opposition to the metallic face, the liquid delivery head having at least one nozzle for directing a liquid towards the metallic face. |
公开日期 | 2018-06-26 |
申请日期 | 2011-08-01 |
状态 | 授权 |
内容类型 | 专利 |
源URL | [http://ir.opt.ac.cn/handle/181661/37530] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | TELEDYNE SCIENTIFIC & IMAGING, LLC |
推荐引用方式 GB/T 7714 | BHUNIA, AVIJIT,CAI, QINGJUN,CHEN, CHUNG-LUNG. System for using active and passive cooling for high power thermal management. US10006720. 2018-06-26. |
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