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	System for using active and passive cooling for high power thermal management
	BHUNIA, AVIJIT; CAI, QINGJUN; CHEN, CHUNG-LUNG
	2018-06-26
著作权人	TELEDYNE SCIENTIFIC & IMAGING, LLC
专利号	US10006720
国家	美国
文献子类	授权发明
其他题名	System for using active and passive cooling for high power thermal management
英文摘要	A cooling system that includes a substrate having a metallic face, at least one microporous wick formation in thermal communication with the metallic face, and a liquid delivery head positioned in complementary opposition to the metallic face, the liquid delivery head having at least one nozzle for directing a liquid towards the metallic face.
公开日期	2018-06-26
申请日期	2011-08-01
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37530]
专题	半导体激光器专利数据库
作者单位	TELEDYNE SCIENTIFIC & IMAGING, LLC
推荐引用方式 GB/T 7714	BHUNIA, AVIJIT,CAI, QINGJUN,CHEN, CHUNG-LUNG. System for using active and passive cooling for high power thermal management. US10006720. 2018-06-26.

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