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	Semiconductor device with a light emitting semiconductor die
	LEE, KONG WENG; NG, KEE YEAN; KUAN, YEW CHEONG; TAN, CHENG WHY; TAN, GIN GHEE
	2015-09-01
著作权人	DOCUMENT SECURITY SYSTEMS, INC.
专利号	US9123869
国家	美国
文献子类	授权发明
其他题名	Semiconductor device with a light emitting semiconductor die
英文摘要	A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements.
公开日期	2015-09-01
申请日期	2011-02-28
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37501]
专题	半导体激光器专利数据库
作者单位	DOCUMENT SECURITY SYSTEMS, INC.
推荐引用方式 GB/T 7714	LEE, KONG WENG,NG, KEE YEAN,KUAN, YEW CHEONG,et al. Semiconductor device with a light emitting semiconductor die. US9123869. 2015-09-01.

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