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	Microscale cooling apparatus and method
	DETERMAN, MATTHEW; LEE, SCOTT W. C. H.; SIU HO, ABEL MANUEL; LEE, SERI
	2014-09-16
著作权人	KES SYSTEMS INC.
专利号	US8833435
国家	美国
文献子类	授权发明
其他题名	Microscale cooling apparatus and method
英文摘要	A method and system for providing a heat sink assembly are described. The assembly includes a two-phase heat sink, a condenser, and a pump. The two-phase heat sink may include flow micro-channels that accommodate the flow of boiling coolant and cross-connect channel(s) that at least partially equilibrate a pressure field for the boiling coolant. The condenser receives coolant from the heat sink and removes heat. The pump drives coolant through the assembly. In one aspect, the assembly is a closed system for the coolant. In another aspect, the condenser includes first and second plates and a heat exchange surface there between. Coolant flows from the heat sink and through the plates. The gaseous coolant passes the heat exchange surface. In one aspect the gaseous coolant flows opposite to the direction coolant flows. In one aspect, at least one of the plates includes dummy channel(s) for insulating part of the plate(s).
公开日期	2014-09-16
申请日期	2009-07-29
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37429]
专题	半导体激光器专利数据库
作者单位	KES SYSTEMS INC.
推荐引用方式 GB/T 7714	DETERMAN, MATTHEW,LEE, SCOTT W. C. H.,SIU HO, ABEL MANUEL,et al. Microscale cooling apparatus and method. US8833435. 2014-09-16.

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