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	Surface mount device
	TANAKA, MINORU; WATANABE, SEISHI
	2012-02-14
著作权人	STANLEY ELECTRIC CO., LTD.
专利号	US8115106
国家	美国
文献子类	授权发明
其他题名	Surface mount device
英文摘要	The disclosed subject matter includes a surface mount electronic device with high reliability and favorable optical characteristics. The surface mount electronic device can include a circuit board with at least one conductor pattern formed on an insulating board and an electronic component that is mounted on a die bonding pad located on the at least one conductor pattern with an adhesive material. The die bonding pad can include a plurality of cutout sections that expose the insulating board and extend towards a center from a circumference thereof. Therefore, the adhesive material can adhere to both the die bonding pad and the insulating board exposed in the plurality of cutout sections along with the electronic component. In this case, the plurality of cutout sections can be formed so as not to drag the adhesive material upwards on each of the side surfaces of the electronic component. Thus, the surface mount electronic device can improve reliability thereof while maintaining predetermined optical characteristics.
公开日期	2012-02-14
申请日期	2008-11-25
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37397]
专题	半导体激光器专利数据库
作者单位	STANLEY ELECTRIC CO., LTD.
推荐引用方式 GB/T 7714	TANAKA, MINORU,WATANABE, SEISHI. Surface mount device. US8115106. 2012-02-14.

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