QQ客服 官方微博 反馈留言

	Methods of assembly for a semiconductor light emitting device package
	ANDREWS, PETER SCOTT
	2015-09-29
著作权人	CREE, INC.
专利号	US9147812
国家	美国
文献子类	授权发明
其他题名	Methods of assembly for a semiconductor light emitting device package
英文摘要	Methods of assembly for a semiconductor light emitting device package may include positioning a submount on a mounting substrate with a flux material therebetween and at least substantially free of solder material therebetween. The submount has a metal bonding layer facing the mounting substrate. A semiconductor light emitting device is positioned on a top side of the submount with a flux material therebetween to provide an assembled stack. The assembled stack is reflowed to attach the metal bonding layer of the submount to the mounting substrate and to attach the light emitting device to the submount.
公开日期	2015-09-29
申请日期	2008-06-24
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37376]
专题	半导体激光器专利数据库
作者单位	CREE, INC.
推荐引用方式 GB/T 7714	ANDREWS, PETER SCOTT. Methods of assembly for a semiconductor light emitting device package. US9147812. 2015-09-29.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。