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	Semiconductor light emitting element and method for manufacturing semiconductor light emitting device
	KAMEI, HIDENORI
	2011-05-31
著作权人	PANASONIC CORPORATION
专利号	US7951625
国家	美国
文献子类	授权发明
其他题名	Semiconductor light emitting element and method for manufacturing semiconductor light emitting device
英文摘要	In a semiconductor light emitting device, light is lost from a side surface of a substrate; therefore, if a substrate side surface occupies a large area, it decreases light extraction efficiency. The area of the substrate side surface may be reduced by reducing a thickness of the substrate. However, a thin substrate has low mechanical strength and is cracked by a stress during work process, and that decreases the yield. A light emitting layer is formed on a substrate. After fixed to a grinding board with wax, the substrate is ground to thin. A support substrate is then bonded to the substrate for reinforcement. The substrate is fixed to an electrode and others, with the support substrate bonded to the substrate. The support substrate is lastly removed.
公开日期	2011-05-31
申请日期	2008-02-19
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37364]
专题	半导体激光器专利数据库
作者单位	PANASONIC CORPORATION
推荐引用方式 GB/T 7714	KAMEI, HIDENORI. Semiconductor light emitting element and method for manufacturing semiconductor light emitting device. US7951625. 2011-05-31.

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