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	Side-view optical diode package and fabricating process thereof
	CHEN, CHIH-MING; HWANG, DENG-HUEI; CHENG, CHING-CHI; WEN, AN-NONG
	2010-04-20
著作权人	SILICON BASE DEVELOPMENT INC.
专利号	US7701050
国家	美国
文献子类	授权发明
其他题名	Side-view optical diode package and fabricating process thereof
英文摘要	A side-view optical diode package is mounted on a printed circuit board with at least a solder bump. The side-view optical diode package includes a silicon substrate, a holding space, a bonding surface and a positioning structure. The silicon substrate has a first surface and a second surface. The holding space has a top opening in the first surface and a bottom for holding an optical diode thereon. The bonding surface is disposed at a lateral side of the silicon substrate and bonded onto the printed circuit board. The positioning structure has at least a solder-receiving portion beside the bonding surface and corresponding to the solder bump. The solder bump is molten during a soldering process and received in the solder-receiving portion, thereby facilitating positioning the silicon substrate on the printed circuit board.
公开日期	2010-04-20
申请日期	2007-12-12
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37353]
专题	半导体激光器专利数据库
作者单位	SILICON BASE DEVELOPMENT INC.
推荐引用方式 GB/T 7714	CHEN, CHIH-MING,HWANG, DENG-HUEI,CHENG, CHING-CHI,et al. Side-view optical diode package and fabricating process thereof. US7701050. 2010-04-20.

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