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	Light emitting package and method of making same
	REGINELLI, JAMES; AANEGOLA, SRINATH, K.; RADKOV, EMIL
	2018-06-27
著作权人	GE LIGHTING SOLUTIONS, LLC
专利号	EP2064752B1
国家	欧洲专利局
文献子类	授权发明
其他题名	Light emitting package and method of making same
英文摘要	In a light emitting package (8), at least one light emitting chip (12, 14, 16, 18) is supported by a board (10). A light transmissive encapsulant (30) is disposed over the at least one light emitting chip and over a footprint area (32) of the board. A light transmissive generally conformal shell (40) is disposed over the encapsulant and has an inner surface (44) spaced apart by an air gap (G) from, and generally conformal with, an outer surface (34) of the encapsulant. At least one phosphor (50) is disposed on or embedded in the conformal shell to output converted light responsive to irradiation by the at least one light emitting chip. A thermally conductive filler material disposed in the generally conformal shell (40) is effective to enhance a thermal conductivity of the composite shell material to a value higher than 0.3 W/(m·K).
公开日期	2018-06-27
申请日期	2007-09-06
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37339]
专题	半导体激光器专利数据库
作者单位	GE LIGHTING SOLUTIONS, LLC
推荐引用方式 GB/T 7714	REGINELLI, JAMES,AANEGOLA, SRINATH, K.,RADKOV, EMIL. Light emitting package and method of making same. EP2064752B1. 2018-06-27.

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