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	Method for manufacturing a surface mount semiconductor device
	OGAWA, YOSHIHIRO; UENO, KAZUHIKO
	2019-01-30
著作权人	STANLEY ELECTRIC CO., LTD.
专利号	EP1814151B1
国家	欧洲专利局
文献子类	授权发明
其他题名	Method for manufacturing a surface mount semiconductor device
英文摘要	A surface mount electronic device manufacturing method can produce surface mount devices at a high yield rate and high productivity by reducing warp of a circuit board. The reduced warp avoids problems in processes for dicing the circuit board. Surface mount LED devices made in accordance with the method can have high reliability and reduced non-uniformity in color tone. The method can include providing an adhesive sheet having window holes at predetermined intervals. The adhesive sheet can be adhered to the circuit board. An attachable board having window holes provided at corresponding positions to the window holes of the adhesive sheet can be adhered to the adhesive sheet. LED chips or other semiconductor devices, laser diodes, etc., can be mounted on the circuit board and located at positions corresponding to bottoms of the window holes. A thermosetting resin can be filled in the window holes for encapsulating the LED chips, etc. The surface mount devices can then be produced by dicing the circuit board.
公开日期	2019-01-30
申请日期	2007-01-31
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37297]
专题	半导体激光器专利数据库
作者单位	STANLEY ELECTRIC CO., LTD.
推荐引用方式 GB/T 7714	OGAWA, YOSHIHIRO,UENO, KAZUHIKO. Method for manufacturing a surface mount semiconductor device. EP1814151B1. 2019-01-30.

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