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	Spray cooling system
	TILTON, CHARLES L.; TILTON, DONALD E.; BADDELEY, RYAN J.; CADER, TAHIR; WOS, GEORGE J.
	2006-08-08
著作权人	PARKER INTANGIBLES LLC
专利号	US7086455
国家	美国
文献子类	授权发明
其他题名	Spray cooling system
英文摘要	A spray cooling system for efficiently thermally managing a single or multiple semiconductor chip package. The spray cooling system includes a heat exchanger unit having a pump unit and a reservoir, a coaxial tube fluidly connected to the heat exchanger unit, a coupler unit attached to the coaxial tube, and a spray module where the coupler unit is removably connected to the spray module. The heat exchanger unit has an air tolerant design that allows for the entry and release of air without interfering with the operation thereof.
公开日期	2006-08-08
申请日期	2004-09-30
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37108]
专题	半导体激光器专利数据库
作者单位	PARKER INTANGIBLES LLC
推荐引用方式 GB/T 7714	TILTON, CHARLES L.,TILTON, DONALD E.,BADDELEY, RYAN J.,et al. Spray cooling system. US7086455. 2006-08-08.

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