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	Package with a substrate of high thermal conductivity
	LUDTKE, ARNDT; WILDNER, HEIKO
	2006-02-14
著作权人	PLANSEE SE
专利号	US6998180
国家	美国
文献子类	授权发明
其他题名	Package with a substrate of high thermal conductivity
英文摘要	A package is configured as a composite component with a substrate, at least one semiconductor component, and an enclosure, which are joined to one another. The heat-dissipating substrate is a single-layer or multilayer substrate with a thermal conductivity, transversely with respect to a joining surface to which the semiconductor component is joined, of greater than 170 W/m. The substrate may be a layered structure and/or a structure of graduated material composition, and it has an asymmetrical thermal expansion characteristic. By suitable selection the layers or the material graduation, it is possible to reduce and limit the shear distortion of the composite component formed of the substrate, the semiconductor component, and the enclosure.
公开日期	2006-02-14
申请日期	2003-03-24
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/36971]
专题	半导体激光器专利数据库
作者单位	PLANSEE SE
推荐引用方式 GB/T 7714	LUDTKE, ARNDT,WILDNER, HEIKO. Package with a substrate of high thermal conductivity. US6998180. 2006-02-14.

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