QQ客服 官方微博 反馈留言

	Heat transfer of solid-state devices
	MACOMBER, STEVEN HENRY; POWERS, JEFFREY
	2004-06-15
著作权人	SPECTRA PHYSICS SEMICONDUCTOR LASERS, INC.
专利号	US6750538
国家	美国
文献子类	授权发明
其他题名	Heat transfer of solid-state devices
英文摘要	In order to provide an improved heat transfer interface between an solid state device and a heat sink to which it is soldered, one or more "vents" are provided in the interface between the solid state device and the heat sink to prevent the entrapment of gases that could form solder voids. Advantageously, the provision of such vents in the interface surface geometry of the semiconductor may be effected by the use of appropriate masking and etching following the epitaxial regrowth process. Alternatively, the heat sink or a solder preform may be provided with suitable notches. The use of such "die-bond vents" also allows solder, after melting, to be forced under the chip by external gas pressure such that no solder voids are left.
公开日期	2004-06-15
申请日期	2002-10-24
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/36934]
专题	半导体激光器专利数据库
作者单位	SPECTRA PHYSICS SEMICONDUCTOR LASERS, INC.
推荐引用方式 GB/T 7714	MACOMBER, STEVEN HENRY,POWERS, JEFFREY. Heat transfer of solid-state devices. US6750538. 2004-06-15.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。