QQ客服 官方微博 反馈留言

	Thermal management system for evaporative spray cooling
	TILTON, CHARLES L.; TILTON, DONALD E.
	2010-11-23
著作权人	PARKER INTANGIBLES LLC
专利号	US7836706
国家	美国
文献子类	授权发明
其他题名	Thermal management system for evaporative spray cooling
英文摘要	A thermal management system configured to maximize the potential of single and multiple atomizers to effectively cool microprocessors and other electronic devices. The thermal management system, which may be a heat spreader, provides surfaces that are disposed to increase the effectiveness of impinging coolant droplets, provide additional heat transfer area in some embodiments, and permit the efficient, customized and disparate thermal management of a recipient object of the thermal management.
公开日期	2010-11-23
申请日期	2002-09-27
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/36925]
专题	半导体激光器专利数据库
作者单位	PARKER INTANGIBLES LLC
推荐引用方式 GB/T 7714	TILTON, CHARLES L.,TILTON, DONALD E.. Thermal management system for evaporative spray cooling. US7836706. 2010-11-23.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。