| Butt joined electronic assembly and module | |
| YANG, KEI-WEAN C. | |
| 2005-10-11 | |
| 著作权人 | TEKTRONIX, INC. |
| 专利号 | US6954569 |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Butt joined electronic assembly and module |
| 英文摘要 | A butt joined electronic assembly has first and second matching coplanar transmission structures that are independently aligned in a proximate abutting relationship. The coplanar transmission structures are formed on respective first and second electrical elements that are secured on respective independently positioned and mechanically joined first and second open end face carriers. The first and second matching coplanar transmission structures are electrically coupled together via substantially flat electrical conductors. |
| 公开日期 | 2005-10-11 |
| 申请日期 | 2002-05-23 |
| 状态 | 授权 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36879]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | TEKTRONIX, INC. |
| 推荐引用方式 GB/T 7714 | YANG, KEI-WEAN C.. Butt joined electronic assembly and module. US6954569. 2005-10-11. |
| 个性服务 |
| 查看访问统计 |
| 相关权益政策 |
| 暂无数据 |
| 收藏/分享 |
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。
修改评论