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	Wafer level packaging for optoelectronic devices
	SHERRER, DAVID W.; DAUTARGAS, MINDAUGUS F.; RICKS, NEIL; STEINBERG, DAN A.
	2008-03-18
著作权人	SAMSUNG ELECTRONICS CO., LTD.
专利号	US7345316
国家	美国
文献子类	授权发明
其他题名	Wafer level packaging for optoelectronic devices
英文摘要	An optical device package includes a substrate having an upper surface, a distal end, a proximal end, and distal and proximal longitudinally extending notches co-linearly aligned with each other. A structure is mounted to the substrate and has at least one recessed portion. The structure can be a lid or a frame to which a lid is bonded. An optical fiber is positioned within at least one of the proximal longitudinally extending notch and the distal longitudinally extending notch and within the recessed portion of the structure mounted to the substrate. The optical device package can also include conductive legs extending upwardly from bonding pads on the upper surface of the substrate to facilitate flip mounting of the optical device package onto a circuit board or other such platform.
公开日期	2008-03-18
申请日期	2001-10-24
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/36792]
专题	半导体激光器专利数据库
作者单位	SAMSUNG ELECTRONICS CO., LTD.
推荐引用方式 GB/T 7714	SHERRER, DAVID W.,DAUTARGAS, MINDAUGUS F.,RICKS, NEIL,et al. Wafer level packaging for optoelectronic devices. US7345316. 2008-03-18.

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