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	Bonding of aluminum oxide components to silicons substrates
	BRADY, MICHAEL FRANCIS; DAUTARTAS, MINDAUGAS FERNAND; DORMER, JAMES F.; MERCHANT, SAILESH MANSINH; NIJANDER, CASIMIR ROMAN; OSENBACH, JOHN WILLIAM
	2000-03-07
著作权人	AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
专利号	US6034405
国家	美国
文献子类	授权发明
其他题名	Bonding of aluminum oxide components to silicons substrates
英文摘要	The invention is a method and resulting device which provides a strong bond between a silicon substrate and an oxide component mounted within a cavity in the substrate. A layer of titanium, for example, is deposited on the walls of the cavity, followed by deposition of a layer of aluminum. The structure is preferably annealed to form titanium silicide and titanium-aluminum interface layers. The component is then bonded to the aluminum layer.
公开日期	2000-03-07
申请日期	1997-07-22
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/36417]
专题	半导体激光器专利数据库
作者单位	AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
推荐引用方式 GB/T 7714	BRADY, MICHAEL FRANCIS,DAUTARTAS, MINDAUGAS FERNAND,DORMER, JAMES F.,et al. Bonding of aluminum oxide components to silicons substrates. US6034405. 2000-03-07.

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