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	Encapsulation of optoelectronic components
	STEIJER, ODD; ERIKSEN, PAUL; MOLL, HANS; ENGSTRAND, JAN .ANG.KE; PALMSKOG, GORAN; JANSON, MATS; TINGHAG, PIA
	1998-10-06
著作权人	TELEFONAKTIEBOLAGET LM ERICSSON
专利号	US5818990
国家	美国
文献子类	授权发明
其他题名	Encapsulation of optoelectronic components
英文摘要	PCT No. PCT/SE95/00281 Sec. 371 Date Jan. 28, 1997 Sec. 102(e) Date Jan. 28, 1997 PCT Filed Mar. 20, 1995 PCT Pub. No. WO95/25974 PCT Pub. Date Sep. 28, 1995An encapsulated optocomponent (1) comprises a single-crystal silicon wafer (3) and waveguides (9) located thereon, which at least partly are manufactured by means of process methods taken from the methods for manufacturing electronic integrated circuits. The waveguides (9) extend from an edge of the optoelectronic component (1) to an optoelectronic, active or passive component (11) attached to the surface of the silicon wafer (3). Over the region for connecting the waveguides (9) to the optoelectronic component (11) a transparent plastics material is molded (17), for instance an elastomer, having a refractive index adjusted to improve the optical coupling between the waveguides (9) and the optoelectronic component (11). The molding (17) covers advantageously all of said component (11) to also reduce thermal stresses between it and an exterior, protective layer (19) of a curable plastics material. The molded layer (17) can also cover the whole area of the waveguides (9) to form an upper cladding thereof. Guide grooves (5) are arranged in the silicon wafer (3) for positioning guide pins (7), utilized in the connection of the optocomponent (1) to another optocomponent having guides for guide pins and waveguides configured in the same way.
公开日期	1998-10-06
申请日期	1995-03-20
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/36241]
专题	半导体激光器专利数据库
作者单位	TELEFONAKTIEBOLAGET LM ERICSSON
推荐引用方式 GB/T 7714	STEIJER, ODD,ERIKSEN, PAUL,MOLL, HANS,et al. Encapsulation of optoelectronic components. US5818990. 1998-10-06.

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