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	Techniques for fabricating and packaging multi-wavelength semiconductor laser array devices (chips) and their applications in system architectures
	MAZED, MOHAMMAD A.
	2002-06-25
著作权人	QUANTUM DEVICES, INC.
专利号	US6411642
国家	美国
文献子类	授权发明
其他题名	Techniques for fabricating and packaging multi-wavelength semiconductor laser array devices (chips) and their applications in system architectures
英文摘要	Phase masks which can be used to make both linear and curved gratings of single or multiple submicron pitches, with or without any abrupt quarter-wavelength shifts (or gradually varying finer phase shifts) simultaneously on the wafer/substrate. The phase masks are made using direct write electron or ion-beam lithography of two times the required submicron pitches of linear and curved gratings on commercially available pi phase-shifting material on a quartz substrate and wet or dry etching of the pi phase-shifting material. The phase masks can be used in connection with making multi-wavelength laser diode chips. The laser diodes have a ridge structure with metal shoulders on either side of the ridge. The laser diode chip, with different wavelength lasers, is bonded and interfaced to a novel microwave substrate that allows for high signal-to-noise ratio and low crosstalk. The substrate is packaged in a low loss rugged housing for WDM applications.
公开日期	2002-06-25
申请日期	2000-03-28
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/35340]
专题	半导体激光器专利数据库
作者单位	QUANTUM DEVICES, INC.
推荐引用方式 GB/T 7714	MAZED, MOHAMMAD A.. Techniques for fabricating and packaging multi-wavelength semiconductor laser array devices (chips) and their applications in system architectures. US6411642. 2002-06-25.

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