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	Semiconductor laser module and method for forming semiconductor laser module
	HATORI, MASAMI
	2004-12-28
著作权人	FUJIFILM CORPORATION
专利号	US6836497
国家	美国
文献子类	授权发明
其他题名	Semiconductor laser module and method for forming semiconductor laser module
英文摘要	A semiconductor laser module is formed by directly bonding a semiconductor laser, which has a wavelength tuning mechanism, and an optical wavelength conversion element which exits laser beam of the second harmonic with the wavelength of the exited laser beam being the fundamental wave. A center wavelength of stimulated emission of the semiconductor laser is tunable, and is locked so as to coincide with a phase matching wavelength of the optical wavelength conversion element. The semiconductor laser and the optical wavelength conversion element are directly bonded together at an end surface portion of an optical wavelength of the optical wavelength conversion element.
公开日期	2004-12-28
申请日期	2000-03-23
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/35339]
专题	半导体激光器专利数据库
作者单位	FUJIFILM CORPORATION
推荐引用方式 GB/T 7714	HATORI, MASAMI. Semiconductor laser module and method for forming semiconductor laser module. US6836497. 2004-12-28.

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