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	Apparatus and method for the accurate positioning of components for flip-chip mounting
	MONNO, BERND; TREUSCH, GEORG; BIESENBACH, JENS
	1997-12-16
著作权人	FINETECH GESELLSCHAFT FUR ELEKTRONIK TECHNOLOGIE MBH
专利号	US5699193
国家	美国
文献子类	授权发明
其他题名	Apparatus and method for the accurate positioning of components for flip-chip mounting
英文摘要	For flip-chip mounting of a component with its contact surface on the contact surface of substrate, the component or the substrate is held at the free end of a lever arm which pivots around an axis, and the other part is held on a support. In a beam path between an optical device, especially a viewing device, and the contact surfaces of the two parts, a semireflecting mirror is provided to provide images of the two contact surfaces simultaneously in the optical viewing device. A first point on the one contact surface, a second point on the other contact surface, a third point on the mirror surface, and the pivot axis of the lever arm form the corners of a square. The beam path between the optical device and the semireflecting mirror is a beam path parallel to the optical axis of the optical device, the beam striking the mirror at an angle of approximately 45 DEG . Before the part is set down onto the other part, a first lens, which focuses the beam path onto this contact surface, is located between the mirror and the contact surface of this one part, while a second lens, which focuses the beam path onto the contact surface of the other part, is provided between the mirror and the contact surface of the other part. The two lenses and the mirror are attached in an aligned state to brackets, the lenses being moved out of the pivot range of the lever arm by means of a motion device before the parts are bonded to each other.
公开日期	1997-12-16
申请日期	1996-07-02
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/35146]
专题	半导体激光器专利数据库
作者单位	FINETECH GESELLSCHAFT FUR ELEKTRONIK TECHNOLOGIE MBH
推荐引用方式 GB/T 7714	MONNO, BERND,TREUSCH, GEORG,BIESENBACH, JENS. Apparatus and method for the accurate positioning of components for flip-chip mounting. US5699193. 1997-12-16.

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