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	High speed laser package
	DIETRICH, NORMAN R.; SMELTZ, JR., PALMER D.
	1993-06-22
著作权人	AMERICAN TELEPHONE AND TELEGRAPH COMPANY, A CORP. OF NY
专利号	US5221860
国家	美国
文献子类	授权发明
其他题名	High speed laser package
英文摘要	An optical package for use with a laser diode in high speed applications. The package comprises a metallic housing with a multilayer ceramic (MLC) insert disposed through a sidewall thereof. The MLC insert is utilized to form a microstrip transmission line of a bandwidth sufficient to couple a high frequency signal source to the laser. A number of conductive vias are disposed through the thickness of the MLC insert at the package wall to serve as electric field shorts within the insert and improve the frequency response of the microstrip. A pair of such MLC inserts may be disposed through opposing sidewalls of the package and used to provide a conventional "butterfly" configuration, while preserving the integrity of the microstrip interconnection.
公开日期	1993-06-22
申请日期	1991-02-19
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/34938]
专题	半导体激光器专利数据库
作者单位	AMERICAN TELEPHONE AND TELEGRAPH COMPANY, A CORP. OF NY
推荐引用方式 GB/T 7714	DIETRICH, NORMAN R.,SMELTZ, JR., PALMER D.. High speed laser package. US5221860. 1993-06-22.

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