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	半導体レーザ素子用ステムの製造方法
	松沢 研一
	1996-11-21
著作权人	新光電気工業株式会社
专利号	JP2583567B2
国家	日本
文献子类	授权发明
其他题名	半導体レーザ素子用ステムの製造方法
英文摘要	PURPOSE:To prevent burrs being projected from a substrate surface and to achieve a stem without any positioning interference due to burrs on packaging and on bonding a semiconductor laser element by forming a recessed part at a part for forming cutout of the substrate previously. CONSTITUTION:A recessed part 20 is provided at an area for forming cutouts 14, 14, and 10 previously before forming the cutouts 14. 14, and 16 when forming a stem for semiconductor laser element. Then, after forming the recessed part 20, press punching is performed from the upper surface side of a substrate 10 toward the lower surface for providing the cutouts 14, 14, and 16. Since this recessed part 20 is machined to have a step difference B which is deeper than the amount of protrusion of a burr 22 generated on press punching, the tip of the burr 22 does not protrude to the outside of the substrate surface exceeding the stage difference. Thus, a stem where no positioning can be prevented on packaging and bonding semiconductor laser element can be obtained.
公开日期	1997-02-19
申请日期	1988-04-08
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/34844]
专题	半导体激光器专利数据库
作者单位	新光電気工業株式会社
推荐引用方式 GB/T 7714	松沢 研一. 半導体レーザ素子用ステムの製造方法. JP2583567B2. 1996-11-21.

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