No title available | |
- | |
1972-11-08 | |
著作权人 | - |
专利号 | GB1295775A |
国家 | 英国 |
文献子类 | 授权发明 |
其他题名 | No title available |
英文摘要 | 1295775 Cooling apparatus RCA CORPORATION 1 April 1970 [1 April 1969] 15379/70 Heading F4U [Also in Division H1] A device to be cooled, e.g. a gas, liquid or crystal laser, an I.C. engine, nuclear reactors, semi-conductor pellets, or chips for dicde junction lasers, silicon rectifiers or transistors, has an external surface forming at least a portion of a wall of a heat pipe, the working fluid in which is in direct contact with the surface by means of the capillary material of the heat pipe which is disposed either in contact with or in close proximity to the surface. As shown, a semiconductor chip 16 with a single P-N junction closes a discontinuity in the envelope portion 14 of a hermetically sealed, self-contained heat pipe vessel 12 of heat conducting material, e.g. copper. The surface 18 of the chip is bonded to the vessel 12 and has the capillary structure 20 of the heat pipe disposed in close proximity thereto so as to retain at least a portion of the vapourizable working medium, e.g. acetone, freon or water, in direct contact with the surface 18 for cooling purposes. Sealing means 30 which may include an hermetically sealed region 38 protects the exposed portion of the chip 16 and comprises metal portions 32, 36 separated by insulation 34. Cooling fins 46 are attached to the vessel 12. In a modification a single electrical device (52), Fig. 3, is mounted between two heat pipes and in a further embodiment a laser (106), Fig. 5, is centrally mounted within a heat pipe. |
公开日期 | 1972-11-08 |
申请日期 | 1970-04-01 |
状态 | 失效 |
内容类型 | 专利 |
源URL | [http://ir.opt.ac.cn/handle/181661/34666] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | - |
推荐引用方式 GB/T 7714 | -. No title available. GB1295775A. 1972-11-08. |
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