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	A method of severing crystalline bodies
	-
	1965-06-23
著作权人	INTERNATIONAL BUSINESS MACHINES CORPORATION
专利号	GB995714A
国家	英国
文献子类	授权发明
其他题名	A method of severing crystalline bodies
英文摘要	995,714. Severing crystals. INTERNATIONAL BUSINESS MACHINES CORPORATION. Oct. 16, 1963 [Oct. 30, 1962], No. 40768/63. Heading B5E. [Also in Divisions H1 and H3] A method of severing a crystalline body 1, such as for use in a laser, comprises the steps of positioning the body to define a plane of minimum bond strength and applying localized stress to the body to separate it into at least two portions along the plane. The body 1 is in the form of a wafer which is separated from a larger crystalline body and provided with surfaces 1, 2 located in planes perpendicular to the plane of minimum bond strength, the said planes being determined by means of X-ray equipment; the surfaces 1, 2 may be finished such as by a lapping or polishing process. The wafer is then laid on a supporting member and a blade 4 forced against its surface 3 in order to cleave it along the plane of minimum bond strength. The blade 4 may be re-positioned so as to cut a rectangular or triangular shaped crystal from the wafer.
公开日期	1965-06-23
申请日期	1963-10-16
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/34647]
专题	半导体激光器专利数据库
作者单位	INTERNATIONAL BUSINESS MACHINES CORPORATION
推荐引用方式 GB/T 7714	-. A method of severing crystalline bodies. GB995714A. 1965-06-23.

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