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	Joining method and device produced by this method and joining unit
	SUGA, TADATOMO; OKADA, MASUAKI
	2014-02-18
著作权人	BONDTECH INC.
专利号	US8651363
国家	美国
文献子类	授权发明
其他题名	Joining method and device produced by this method and joining unit
英文摘要	A practical bonding technique is provided for solid-phase room-temperature bonding not requiring a profile irregularity of the order of several nanometers, in which a high-vacuum energy wave treatment and continuous high-vacuum bonding are not required. Since an adhering substance layer is thin immediately after a surface activating treatment using an energy wave, a bonding interface is spread by crushing the adhering substance layer to perform bonding, so that a new surface appears on a bonding surface, and objects to be bonded are bonded together. In order to crush the adhering substance layer more easily, a bonding metal of a bonding portion of the object to be bonded requires a low hardness. According to the results of various experiments conducted by the present inventors, it was found that the hardness of the bonding portion which is a Vickers hardness of 200 Hv or less is particularly effective for room-temperature bonding.
公开日期	2014-02-18
申请日期	2011-11-16
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/34098]
专题	半导体激光器专利数据库
作者单位	BONDTECH INC.
推荐引用方式 GB/T 7714	SUGA, TADATOMO,OKADA, MASUAKI. Joining method and device produced by this method and joining unit. US8651363. 2014-02-18.

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